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HSS27-B20-P43

CUI Devices

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HSS27-B20-P43

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HEAT SINK, STAMPING, TO-218/TO-2

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Fins
Width	0.874" (22.20mm)
Length	1.193" (30.30mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum Alloy
Fin Height	0.211" (5.35mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Natural	24.79°C/W
Power Dissipation @ Temperature Rise	3.03W @ 75°C
Thermal Resistance @ Forced Air Flow	13.20°C/W @ 200 LFM