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HSB17-404025

CUI Devices

Product No:

HSB17-404025

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 40 X 40 X 25 MM

Quantity:

Delivery:

Payment:

In Stock : 804

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2.4035

    $2.4035

  • 10

    $2.3427

    $23.427

  • 25

    $2.27962

    $56.9905

  • 50

    $2.15308

    $107.654

  • 100

    $2.026445

    $202.6445

  • 250

    $1.89981

    $474.9525

  • 500

    $1.836483

    $918.2415

  • 1000

    $1.646502

    $1646.502

  • 5000

    $1.614838

    $8074.19

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HSB17-404025 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.575" (40.00mm)
Length 1.575" (40.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 6.41°C/W
Power Dissipation @ Temperature Rise 11.7W @ 75°C
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM