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CUI Devices
Product No:
HSB17-404025
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 40 X 40 X 25 MM
Quantity:
Delivery:
Payment:
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$2.4035
$2.4035
10
$2.3427
$23.427
25
$2.27962
$56.9905
50
$2.15308
$107.654
100
$2.026445
$202.6445
250
$1.89981
$474.9525
500
$1.836483
$918.2415
1000
$1.646502
$1646.502
5000
$1.614838
$8074.19
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Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 1.575" (40.00mm) |
Length | 1.575" (40.00mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.984" (25.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 6.41°C/W |
Power Dissipation @ Temperature Rise | 11.7W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |