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HSS25-B20-P51

CUI Devices

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HSS25-B20-P51

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HEAT SINK, STAMPING, TO-218/TO-2

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Mfr	CUI Devices
Type	Board Level
Shape	Square, Fins
Width	1.000" (25.40mm)
Length	1.000" (25.40mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	1.673" (42.50mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Thermal Resistance @ Natural	12.75°C/W
Power Dissipation @ Temperature Rise	5.88W @ 75°C
Thermal Resistance @ Forced Air Flow	6.30°C/W @ 200 LFM