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HSS08-B18-CP

CUI Devices

Product No:

HSS08-B18-CP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218, 44.

Quantity:

Delivery:

Payment:

In Stock : 988

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.9475

    $1.9475

  • 10

    $1.89905

    $18.9905

  • 25

    $1.84794

    $46.1985

  • 50

    $1.74534

    $87.267

  • 100

    $1.642645

    $164.2645

  • 250

    $1.539988

    $384.997

  • 500

    $1.488669

    $744.3345

  • 1000

    $1.334664

    $1334.664

  • 5000

    $1.308996

    $6544.98

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HSS08-B18-CP - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level, Vertical
Shape Square
Width 1.750" (44.45mm)
Length 1.750" (44.45mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.492" (12.50mm)
Package Cooled TO-218
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 7.29°C/W
Power Dissipation @ Temperature Rise 10.3W @ 75°C
Thermal Resistance @ Forced Air Flow 3.50°C/W @ 200 LFM