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HSS21-B20-P53

CUI Devices

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HSS21-B20-P53

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HEAT SINK, STAMPING, TO-218/TO-2

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	0.961" (24.40mm)
Length	1.000" (25.40mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.500" (12.70mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Thermal Resistance @ Natural	20.93°C/W
Power Dissipation @ Temperature Rise	3.58W @ 75°C
Thermal Resistance @ Forced Air Flow	10.10°C/W @ 200 LFM