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HSS19-B20-NP

CUI Devices

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HSS19-B20-NP

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HEAT SINK, STAMPING, TO-218/TO-2

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Mfr	CUI Devices
Type	Top Mount
Shape	Rectangular, Fins
Width	0.748" (19.00mm)
Length	0.866" (22.00mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum Alloy
Fin Height	0.748" (19.00mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On
Thermal Resistance @ Natural	22.39°C/W
Power Dissipation @ Temperature Rise	3.35W @ 75°C
Thermal Resistance @ Forced Air Flow	8.80°C/W @ 200 LFM