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HSS14-B20-NP

CUI Devices

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HSS14-B20-NP

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Description:

HEAT SINK, STAMPING, TO-220, 19.

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular
Width	0.750" (19.05mm)
Length	0.980" (24.89mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.157" (4.00mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	-
Thermal Resistance @ Natural	23.91°C/W
Power Dissipation @ Temperature Rise	3.1W @ 75°C
Thermal Resistance @ Forced Air Flow	11.60°C/W @ 200 LFM