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HSS12-B20-P95

CUI Devices

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HSS12-B20-P95

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HEAT SINK, STAMPING, TO-220, 19

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular
Width	0.748" (19.00mm)
Length	0.866" (22.00mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.433" (11.00mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Thermal Resistance @ Natural	27.37°C/W
Power Dissipation @ Temperature Rise	2.7W @ 75°C
Thermal Resistance @ Forced Air Flow	10.90°C/W @ 200 LFM