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HSS-C2540-SMT-TR

CUI Devices

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HSS-C2540-SMT-TR

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HEAT SINK TO-263 COPPER

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	1.000" (25.40mm)
Length	0.763" (19.38mm)
Series	HSS
Package	Tape & Reel (TR)
Diameter	-
Material	Copper
Fin Height	0.450" (11.43mm)
Package Cooled	TO-263 (D²Pak)
Product Status	Active
Material Finish	Tin
Attachment Method	-
Base Product Number	HSS-C2540
Thermal Resistance @ Natural	21.90°C/W
Power Dissipation @ Temperature Rise	3.8W @ 75°C
Thermal Resistance @ Forced Air Flow	5.50°C/W @ 200 LFM