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HSS-B20-NP-13

CUI Devices

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HSS-B20-NP-13

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HEATSINK TO-220 3.9W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	1.750" (44.45mm)
Length	0.700" (17.78mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	0.375" (9.52mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On
Base Product Number	HSS-B20
Thermal Resistance @ Natural	19.22°C/W
Power Dissipation @ Temperature Rise	3.9W @ 75°C
Thermal Resistance @ Forced Air Flow	5.88°C/W @ 200 LFM