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HSS-B20-NP-11

CUI Devices

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HSS-B20-NP-11

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HEATSINK TO-220 4.4W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	0.779" (19.80mm)
Length	0.700" (17.78mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	0.850" (21.60mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On
Base Product Number	HSS-B20
Thermal Resistance @ Natural	17.05°C/W
Power Dissipation @ Temperature Rise	4.4W @ 75°C
Thermal Resistance @ Forced Air Flow	6.86°C/W @ 200 LFM