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HSS-B20-NP-04

CUI Devices

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HSS-B20-NP-04

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HEATSINK TO-220 6.5W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	1.750" (44.45mm)
Length	1.450" (36.83mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum
Fin Height	0.370" (9.40mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On
Base Product Number	HSS-B20
Thermal Resistance @ Natural	11.54°C/W
Power Dissipation @ Temperature Rise	6.5W @ 75°C
Thermal Resistance @ Forced Air Flow	3.76°C/W @ 200 LFM