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HSS-B20-NP-02

CUI Devices

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HSS-B20-NP-02

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HEATSINK TO-220 3.6W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	0.830" (21.08mm)
Length	0.748" (19.00mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	0.394" (10.00mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	-
Base Product Number	HSS-B20
Thermal Resistance @ Natural	20.59°C/W
Power Dissipation @ Temperature Rise	3.6W @ 75°C
Thermal Resistance @ Forced Air Flow	5.39°C/W @ 200 LFM