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HSS-B20-NP-01

CUI Devices

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HSS-B20-NP-01

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HEATSINK TO-220 4.1W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	0.775" (19.68mm)
Length	0.787" (20.00mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	0.303" (7.70mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	-
Base Product Number	HSS-B20
Thermal Resistance @ Natural	18.29°C/W
Power Dissipation @ Temperature Rise	4.1W @ 75°C
Thermal Resistance @ Forced Air Flow	7.05°C/W @ 200 LFM