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HSS-B20-0635H-01

CUI Devices

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HSS-B20-0635H-01

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HEATSINK TO-220 2.7W ALUMINUM

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Fins
Width	0.375" (9.53mm)
Length	0.520" (13.20mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	0.748" (19.00mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Base Product Number	HSS-B20
Thermal Resistance @ Natural	27.78°C/W
Power Dissipation @ Temperature Rise	2.7W @ 75°C
Thermal Resistance @ Forced Air Flow	9.51°C/W @ 200 LFM