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HSS-B20-061H-02

CUI Devices

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HSS-B20-061H-02

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HEATSINK TO-220 2.9W ALUMINUM

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Fins
Width	0.504" (12.80mm)
Length	0.500" (12.70mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	0.748" (19.00mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Base Product Number	HSS-B20
Thermal Resistance @ Natural	25.92°C/W
Power Dissipation @ Temperature Rise	2.9W @ 75°C
Thermal Resistance @ Forced Air Flow	7.24°C/W @ 200 LFM