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HSS-B20-053H-01

CUI Devices

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HSS-B20-053H-01

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HEATSINK TO-220 4.8W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	1.000" (25.40mm)
Length	0.500" (12.70mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum
Fin Height	1.181" (30.00mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Base Product Number	HSS-B20
Thermal Resistance @ Natural	15.79°C/W
Power Dissipation @ Temperature Rise	4.8W @ 75°C
Thermal Resistance @ Forced Air Flow	5.83°C/W @ 200 LFM