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HSE11-B20-NP

CUI Devices

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HSE11-B20-NP

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HEAT SINK, EXTRUSION, TO-218/TO-

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Mfr	CUI Devices
Type	Top Mount
Shape	Rectangular
Width	0.472" (12.00mm)
Length	0.984" (25.00mm)
Series	HSE
Package	Bag
Diameter	-
Material	Aluminum Alloy
Fin Height	0.177" (4.50mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On
Thermal Resistance @ Natural	38.90°C/W
Power Dissipation @ Temperature Rise	1.93W @ 75°C
Thermal Resistance @ Forced Air Flow	21.40°C/W @ 200 LFM