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CUI Devices
Product No:
HSE-B500-04H
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, EXTRUSION, TO-220, 50
Quantity:
Delivery:
Payment:
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Mfr | CUI Devices |
Type | Board Level, Vertical |
Shape | Rectangular, Fins |
Width | 1.378" (35.00mm) |
Length | 1.969" (50.00mm) |
Series | HSE |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 1.000" (25.40mm) |
Package Cooled | TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Bolt On and PC Pin |
Base Product Number | HSE-B500 |
Thermal Resistance @ Natural | 8.05°C/W |
Power Dissipation @ Temperature Rise | 12.2W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.88°C/W @ 200 LFM |