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HSE-B500-04H

CUI Devices

Product No:

HSE-B500-04H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-220, 50

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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HSE-B500-04H - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 1.378" (35.00mm)
Length 1.969" (50.00mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 1.000" (25.40mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B500
Thermal Resistance @ Natural 8.05°C/W
Power Dissipation @ Temperature Rise 12.2W @ 75°C
Thermal Resistance @ Forced Air Flow 2.88°C/W @ 200 LFM