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HSE-B254-04H

CUI Devices

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HSE-B254-04H

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HEAT SINK, EXTRUSION, TO-220/TO-

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Fins
Width	0.650" (16.50mm)
Length	1.000" (25.40mm)
Series	HSE
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.630" (16.00mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Base Product Number	HSE-B254
Thermal Resistance @ Natural	15.96°C/W
Power Dissipation @ Temperature Rise	4.7W @ 75°C
Thermal Resistance @ Forced Air Flow	4.93°C/W @ 200 LFM