Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HSE-B20250-040H-01

CUI Devices

Product No:

HSE-B20250-040H-01

Manufacturer:

Package:

Batch:

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-220, 25

Quantity:

Delivery:

Payment:

In Stock : 1281

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

Not the price you want? Send RFQ Now and we'll contact you ASAP.

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Angled Fins
Width	1.359" (34.50mm)
Length	0.984" (25.00mm)
Series	HSE
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.492" (12.50mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Base Product Number	HSE-B20250
Thermal Resistance @ Natural	13.64°C/W
Power Dissipation @ Temperature Rise	5.5W @ 75°C
Thermal Resistance @ Forced Air Flow	4.44°C/W @ 200 LFM