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HSB28-606022

CUI Devices

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HSB28-606022

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HEAT SINK, BGA, 60 X 60 X 22 MM,

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Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	2.362" (60.00mm)
Length	2.362" (60.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.866" (22.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Push Pin
Thermal Resistance @ Natural	4.74°C/W
Power Dissipation @ Temperature Rise	15.83W @ 75°C
Thermal Resistance @ Forced Air Flow	1.40°C/W @ 200 LFM