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HSB22-606010

CUI Devices

Product No:

HSB22-606010

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 60 X 60 X 10 MM

Quantity:

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Payment:

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HSB22-606010 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 2.362" (60.00mm)
Length 2.362" (60.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 7.62°C/W
Power Dissipation @ Temperature Rise 9.8W @ 75°C
Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM