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CUI Devices
Product No:
HSB22-606010
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 60 X 60 X 10 MM
Quantity:
Delivery:
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Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 2.362" (60.00mm) |
Length | 2.362" (60.00mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum |
Fin Height | 0.394" (10.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 7.62°C/W |
Power Dissipation @ Temperature Rise | 9.8W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.60°C/W @ 200 LFM |