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CUI Devices
Product No:
HSB19-272718
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 27 X 27 X 18 MM
Quantity:
Delivery:
Payment:
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$1.8335
$1.8335
10
$1.73755
$17.3755
25
$1.69176
$42.294
50
$1.64597
$82.2985
100
$1.554485
$155.4485
250
$1.463038
$365.7595
500
$1.37161
$685.805
1000
$1.280163
$1280.163
5000
$1.234449
$6172.245
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Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 1.063" (27.00mm) |
Length | 1.063" (27.00mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.709" (18.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 11.11°C/W |
Power Dissipation @ Temperature Rise | 6.8W @ 75°C |
Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |