Home / Heat Sinks / HSB19-272718

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HSB19-272718

CUI Devices

Product No:

HSB19-272718

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 27 X 27 X 18 MM

Quantity:

Delivery:

Payment:

In Stock : 631

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.8335

    $1.8335

  • 10

    $1.73755

    $17.3755

  • 25

    $1.69176

    $42.294

  • 50

    $1.64597

    $82.2985

  • 100

    $1.554485

    $155.4485

  • 250

    $1.463038

    $365.7595

  • 500

    $1.37161

    $685.805

  • 1000

    $1.280163

    $1280.163

  • 5000

    $1.234449

    $6172.245

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HSB19-272718 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.063" (27.00mm)
Length 1.063" (27.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 11.11°C/W
Power Dissipation @ Temperature Rise 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM