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HSB13-303014

CUI Devices

Product No:

HSB13-303014

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 30.7 X 30.7 X 14

Quantity:

Delivery:

Payment:

In Stock : 419

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.2825

    $1.2825

  • 10

    $1.2217

    $12.217

  • 25

    $1.1894

    $29.735

  • 50

    $1.1571

    $57.855

  • 100

    $1.09288

    $109.288

  • 250

    $1.028584

    $257.146

  • 500

    $0.964288

    $482.144

  • 1000

    $0.900011

    $900.011

  • 5000

    $0.867863

    $4339.315

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HSB13-303014 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.209" (30.70mm)
Length 1.209" (30.70mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.551" (14.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 12.36°C/W
Power Dissipation @ Temperature Rise 6.1W @ 75°C
Thermal Resistance @ Forced Air Flow 4.70°C/W @ 200 LFM