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HSB11-252518

CUI Devices

Product No:

HSB11-252518

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 25 X 25 X 18 MM

Quantity:

Delivery:

Payment:

In Stock : 54

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.216

    $1.216

  • 10

    $1.15235

    $11.5235

  • 25

    $1.12176

    $28.044

  • 50

    $1.09155

    $54.5775

  • 100

    $1.030845

    $103.0845

  • 250

    $0.970254

    $242.5635

  • 500

    $0.909606

    $454.803

  • 1000

    $0.848968

    $848.968

  • 5000

    $0.818644

    $4093.22

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HSB11-252518 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.984" (25.00mm)
Length 0.984" (25.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 13.70°C/W
Power Dissipation @ Temperature Rise 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM