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HSB08-212106
CUI Devices
Product No:
HSB08-212106
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 21 X 21 X 6 MM
Quantity:
Delivery:
Payment:
In Stock : 1621 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.8455
$0.8455
10
$0.8018
$8.018
25
$0.7619
$19.0475
50
$0.74195
$37.0975
100
$0.731975
$73.1975
250
$0.681834
$170.4585
500
$0.641706
$320.853
1000
$0.581552
$581.552
5000
$0.561498
$2807.49
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HSB08-212106 - Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.827" (21.00mm) |
| Length | 0.827" (21.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.236" (6.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 25.40°C/W |
| Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 9.70°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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