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HSB07-202009

CUI Devices

Product No:

HSB07-202009

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 20 X 20 X 9 MM

Quantity:

Delivery:

Payment:

In Stock : 1257

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.798

    $0.798

  • 10

    $0.7619

    $7.619

  • 25

    $0.7239

    $18.0975

  • 50

    $0.70471

    $35.2355

  • 100

    $0.69521

    $69.521

  • 250

    $0.647558

    $161.8895

  • 500

    $0.609482

    $304.741

  • 1000

    $0.55234

    $552.34

  • 5000

    $0.533292

    $2666.46

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HSB07-202009 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.787" (20.00mm)
Length 0.787" (20.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.354" (9.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 24.08°C/W
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow 8.60°C/W @ 200 LFM