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CUI Devices
Product No:
HSB07-202009
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 20 X 20 X 9 MM
Quantity:
Delivery:
Payment:
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.798
$0.798
10
$0.7619
$7.619
25
$0.7239
$18.0975
50
$0.70471
$35.2355
100
$0.69521
$69.521
250
$0.647558
$161.8895
500
$0.609482
$304.741
1000
$0.55234
$552.34
5000
$0.533292
$2666.46
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Mfr | CUI Devices |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 0.787" (20.00mm) |
Length | 0.787" (20.00mm) |
Series | HSB |
Package | Box |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 0.354" (9.00mm) |
Package Cooled | BGA |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Thermal Resistance @ Natural | 24.08°C/W |
Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
Thermal Resistance @ Forced Air Flow | 8.60°C/W @ 200 LFM |