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HSB04-171706

CUI Devices

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HSB04-171706

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HEAT SINK, BGA, 17 X 17 X 6 MM

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Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.669" (17.00mm)
Length	0.669" (17.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.236" (6.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	29.73°C/W
Power Dissipation @ Temperature Rise	2.5W @ 75°C
Thermal Resistance @ Forced Air Flow	13.10°C/W @ 200 LFM