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HSB02-101007

CUI Devices

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HSB02-101007

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HEAT SINK, BGA, 10 X 10 X 7 MM

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Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.394" (10.00mm)
Length	0.394" (10.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.275" (7.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	37.90°C/W
Power Dissipation @ Temperature Rise	2.0W @ 75°C
Thermal Resistance @ Forced Air Flow	16.50°C/W @ 200 LFM