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WB3F200VD1

JAE Electronics

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WB3F200VD1

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CONN RCPT 200POS SMD GOLD

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Mfr	JAE Electronics
Pitch	0.020" (0.50mm)
Series	WB3
Package	Tray
Features	Board Guide, Solder Retention
Mounting Type	Surface Mount
Connector Type	Receptacle, Center Strip Contacts
Contact Finish	Gold
Number of Rows	2
Product Status	Obsolete
Height Above Board	0.098" (2.50mm)
Base Product Number	WB3F200
Number of Positions	200
Mated Stacking Heights	4mm, 5mm
Contact Finish Thickness	30.0µin (0.76µm)