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TS391SNL250

Chip Quik Inc.

Product No:

TS391SNL250

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Description:

THERMALLY STABLE SOLDER PASTE NO

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Mfr	Chip Quik Inc.
Form	Jar, 8.8 oz (250g)
Type	Solder Paste
Series	-
Package	Bulk
Process	Lead Free
Diameter	-
Flux Type	No-Clean
Mesh Type	4
Shelf Life	12 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Shipping Info	-
Product Status	Active
Shelf Life Start	Date of Manufacture
Base Product Number	TS391S
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)