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SMDSWLF.006 1G

Chip Quik Inc.

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SMDSWLF.006 1G

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Description:

SOLDER WIRE SN96.5/AG3/CU0.5

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Mfr	Chip Quik Inc.
Form	Spool, 0.035 oz (1g)
Type	Wire Solder
Series	-
Weight	-
Package	Bulk
Process	Lead Free
Diameter	0.006" (0.15mm)
Flux Type	No-Clean, Water Soluble
Shelf Life	-
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Shipping Info	-
Product Status	Active
Shelf Life Start	-
Storage/Refrigeration Temperature	-