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SMDLTLFP250T4

Chip Quik Inc.

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SMDLTLFP250T4

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Description:

SOLDER PASTE LOW TEMP T4 250G

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Mfr	Chip Quik Inc.
Form	Jar, 8.8 oz (250g)
Type	Solder Paste
Series	-
Package	Jar
Process	Lead Free
Diameter	-
Flux Type	No-Clean
Mesh Type	4
Shelf Life	6 Months
Wire Gauge	-
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point	281°F (138°C)
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Product Status	Active
Digi-Key Storage	Refrigerated
Shelf Life Start	Date of Manufacture
Base Product Number	SMDLTL
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)