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SMD4300SNL250T3

Chip Quik Inc.

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SMD4300SNL250T3

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Description:

SOLDER PASTE SAC305 250G T3

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Mfr	Chip Quik Inc.
Form	Jar, 8.8 oz (250g)
Type	Solder Paste
Series	CHIPQUIK® SMD4300
Weight	0.551 lb (249.93 g)
Package	Jar
Process	Lead Free
Diameter	-
Flux Type	No-Clean, Water Soluble
Mesh Type	3
Shelf Life	6 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Product Status	Active
Digi-Key Storage	Refrigerated
Shelf Life Start	Date of Manufacture
Base Product Number	SMD4300
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)