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Chip Quik Inc.
Product No:
SMD291SNL60T4
Manufacturer:
Package:
-
Batch:
-
Description:
SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Quantity:
Delivery:
Payment:
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Mfr | Chip Quik Inc. |
Form | Jar, 2.12 oz (60g) |
Type | Solder Paste, Two Part Mix |
Series | - |
Package | Jar |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 24 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | SMD291 |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |