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SIDC56D170E6X1SA1

Infineon Technologies

Product No:

SIDC56D170E6X1SA1

Manufacturer:

Infineon Technologies

Package:

Sawn on foil

Batch:

-

Datasheet:

-

Description:

DIODE GP 1.7KV 75A WAFER

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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SIDC56D170E6X1SA1 - Product Information

Parameter Info

User Guide

Mfr Infineon Technologies
Speed Standard Recovery >500ns, > 200mA (Io)
Series -
Package Bulk
Technology Standard
Mounting Type Surface Mount
Package / Case Die
Product Status Discontinued at Digi-Key
Base Product Number SIDC56D
Capacitance @ Vr, F -
Supplier Device Package Sawn on foil
Current - Reverse Leakage @ Vr 27 µA @ 1700 V
Voltage - DC Reverse (Vr) (Max) 1700 V
Current - Average Rectified (Io) 75A
Operating Temperature - Junction -40°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If 2.15 V @ 75 A