Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

SIDC32D170HX1SA3

Infineon Technologies

Product No:

SIDC32D170HX1SA3

Manufacturer:

Package:

Sawn on foil

Batch:

Datasheet:

Description:

DIODE GP 1.7KV 50A WAFER

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Country

Quantity

Mfr	Infineon Technologies
Speed	Standard Recovery >500ns, > 200mA (Io)
Series	-
Package	Bulk
Technology	Standard
Mounting Type	Surface Mount
Package / Case	Die
Product Status	Discontinued at Digi-Key
Base Product Number	SIDC32D
Capacitance @ Vr, F	-
Supplier Device Package	Sawn on foil
Current - Reverse Leakage @ Vr	27 µA @ 1700 V
Voltage - DC Reverse (Vr) (Max)	1700 V
Current - Average Rectified (Io)	50A
Operating Temperature - Junction	-55°C ~ 150°C
Voltage - Forward (Vf) (Max) @ If	1.8 V @ 50 A