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S1C17W22D00B000

Epson Electronics America Inc-Semiconductor Div

Product No:

S1C17W22D00B000

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Die

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Description:

IC MCU 16BIT 64KB FLASH DIE

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Mfr	Epson Electronics America Inc-Semiconductor Div
Speed	4.2MHz
Series	-
Package	Tape & Reel (TR)
RAM Size	4K x 8
Core Size	16-Bit
EEPROM Size	-
Peripherals	LCD, PWM, RFC, WDT
Connectivity	I²C, IrDA, SPI, UART/USART
Mounting Type	Surface Mount
Number of I/O	41
Core Processor	S1C17
Package / Case	Die
Product Status	Obsolete
Data Converters	-
Oscillator Type	Internal
Base Product Number	S1C17W22
Program Memory Size	64KB (64K x 8)
Program Memory Type	FLASH
DigiKey Programmable	Not Verified
Operating Temperature	-40°C ~ 85°C (TA)
Supplier Device Package	Die
Voltage - Supply (Vcc/Vdd)	1.2V ~ 3.6V