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S1C17F57D00E200

Epson Electronics America Inc-Semiconductor Div

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S1C17F57D00E200

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IC MCU 16BIT 32KB FLASH DIE

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Mfr	Epson Electronics America Inc-Semiconductor Div
Speed	4.2MHz
Series	-
Package	Tape & Reel (TR)
RAM Size	2K x 8
Core Size	16-Bit
EEPROM Size	-
Peripherals	PWM, WDT
Connectivity	I²C, IrDA, SPI, UART/USART
Mounting Type	Surface Mount
Number of I/O	29
Core Processor	S1C17
Package / Case	Die
Product Status	Obsolete
Data Converters	-
Oscillator Type	Internal
Base Product Number	S1C17F57
Program Memory Size	32KB (32K x 8)
Program Memory Type	FLASH
DigiKey Programmable	Not Verified
Operating Temperature	-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V