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R7F702002AEABA-C#BC0

Renesas Electronics America Inc

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373-FBGA (21x21)

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Description:

32BIT MCU RH850/E2X 373BGA

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Mfr	Renesas Electronics America Inc
Speed	400MHz
Series	RH850/E2M
Package	Tray
RAM Size	768K x 8
Core Size	32-Bit
EEPROM Size	224K x 8
Peripherals	DMA, PWM, Temp Sensor, WDT
Connectivity	CANbus, CSI, Ethernet, FlexRay, LINbus, PSI5S, SCI, SENT, UART/USART
Mounting Type	Surface Mount
Core Processor	RH850G4MH
Package / Case	373-FBGA
Product Status	Active
Data Converters	A/D 80x10b, 80x12b SAR
Oscillator Type	Internal
Program Memory Size	8MB (8M x 8)
Program Memory Type	FLASH
Operating Temperature	-40°C ~ 150°C (TJ)
Supplier Device Package	373-FBGA (21x21)
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V, 3V ~ 5.5V