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R7F7017143ABG-C#BC1

Renesas Electronics America Inc

Product No:

R7F7017143ABG-C#BC1

Package:

324-FBGA (19x19)

Batch:

-

Datasheet:

-

Description:

32BIT MCU RH850/F1KH-D8 BGA324

Quantity:

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R7F7017143ABG-C#BC1 - Product Information

Parameter Info

User Guide

Mfr Renesas Electronics America Inc
Speed 240MHz
Series RH850/F1KH-D8
Package Tray
RAM Size 896K x 8
Core Size 32-Bit Dual-Core
EEPROM Size 256K x 8
Peripherals DMA, PWM, WDT
Connectivity CANbus, CSI, I²C, LINbus, SPI, UART/USART
Mounting Type Surface Mount
Number of I/O 246
Core Processor RH850G3KH
Package / Case 324-FBGA
Product Status Active
Data Converters A/D 38x10b, 32x12b
Oscillator Type Internal
Program Memory Size 6MB (6M x 8)
Program Memory Type FLASH
Operating Temperature -40°C ~ 105°C (TA)
Supplier Device Package 324-FBGA (19x19)
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V