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R7F7016534ABG-C#HC1

Renesas Electronics America Inc

Product No:

R7F7016534ABG-C#HC1

Manufacturer:

Package:

272-FBGA (17x17)

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Datasheet:

Description:

32BIT MCU RH850/F1KM BGA272 +125

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Mfr	Renesas Electronics America Inc
Speed	240MHz
Series	RH850/F1x
Package	Tape & Reel (TR)
RAM Size	512K x 8
Core Size	32-Bit
EEPROM Size	128K x 8
Peripherals	DMA, LVD, PWM, WDT
Connectivity	CANbus, CSI, I²C, LINbus, SENT, SPI, UART/USART
Mounting Type	Surface Mount
Number of I/O	214
Core Processor	RH850G3KH
Package / Case	272-FBGA
Product Status	Active
Data Converters	A/D 38x10b, 32x12b
Oscillator Type	Internal
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
Operating Temperature	-40°C ~ 125°C (TA)
Supplier Device Package	272-FBGA (17x17)
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V