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R7F7016534ABG-C#AC1

Renesas Electronics America Inc

Product No:

R7F7016534ABG-C#AC1

Package:

272-FBGA (17x17)

Batch:

-

Datasheet:

-

Description:

32BIT MCU RH850/F1KM-PREMIUM SC2

Quantity:

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R7F7016534ABG-C#AC1 - Product Information

Parameter Info

User Guide

Mfr Renesas Electronics America Inc
Speed 240MHz
Series RH850/F1x
Package Tray
RAM Size 512K x 8
Core Size 32-Bit
EEPROM Size 128K x 8
Peripherals DMA, LVD, PWM, WDT
Connectivity CANbus, CSI, I²C, LINbus, SENT, SPI, UART/USART
Mounting Type Surface Mount
Number of I/O 214
Core Processor RH850G3KH
Package / Case 272-FBGA
Product Status Active
Data Converters A/D 38x10b, 32x12b
Oscillator Type Internal
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
Operating Temperature -40°C ~ 125°C (TA)
Supplier Device Package 272-FBGA (17x17)
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V