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R7F701372AEABG-C#BC1

Renesas Electronics America Inc

Product No:

R7F701372AEABG-C#BC1

Package:

292-FBGA (17x17)

Batch:

-

Datasheet:

-

Description:

32BIT MCU

Quantity:

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R7F701372AEABG-C#BC1 - Product Information

Parameter Info

User Guide

Mfr Renesas Electronics America Inc
Speed 240MHz
Series RH850/P1H-C
Package Tray
RAM Size 1.0625M x 8
Core Size 32-Bit Quad-Core
EEPROM Size 128K x 8
Peripherals DMA, POR, PWM, Temp Sensor, WDT
Connectivity CANbus, CSI, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART
Mounting Type Surface Mount
Core Processor RH850G3M
Package / Case 292-FBGA
Product Status Active
Data Converters A/D 32x12b
Oscillator Type Internal
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
Operating Temperature -40°C ~ 150°C (TA)
Supplier Device Package 292-FBGA (17x17)
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V