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PA0170
Chip Quik Inc.
Product No:
PA0170
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
MINI SOIC-8 EXP PAD TO DIP-8 SMT
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
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PA0170 - Product Information
Parameter Info
User Guide
| Mfr | Chip Quik Inc. |
| Pitch | 0.026" (0.65mm) |
| Series | Proto-Advantage |
| Package | Bulk |
| Material | FR4 Epoxy Glass |
| Product Status | Active |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Package Accepted | MiniSOIC EP |
| Proto Board Type | SMD to DIP |
| Size / Dimension | 0.700" x 0.400" (17.78mm x 10.16mm) |
| Number of Positions | 8 |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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