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NCSWLF.020 1LB

Chip Quik Inc.

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NCSWLF.020 1LB

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Description:

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

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Mfr	Chip Quik Inc.
Form	Spool, 1 lb (454 g)
Type	Wire Solder
Series	-
Package	Bulk
Process	Lead Free
Diameter	0.020" (0.51mm)
Flux Type	No-Clean
Shelf Life	-
Wire Gauge	24 AWG, 25 SWG
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	422 ~ 428°F (217 ~ 220°C)
Product Status	Active
Shelf Life Start	-
Base Product Number	NCSW
Storage/Refrigeration Temperature	-