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NC3SWLF.031 1LB

Chip Quik Inc.

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NC3SWLF.031 1LB

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Description:

LF SOLDER WIRE 96.5/3.5 TIN/SILV

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Mfr	Chip Quik Inc.
Form	Spool, 1 lb (454 g)
Type	Wire Solder
Series	-
Package	Bulk
Process	Lead Free
Diameter	0.031" (0.79mm)
Flux Type	No-Clean
Shelf Life	-
Wire Gauge	20 AWG, 21 SWG
Composition	Sn96.5Ag3.5 (96.5/3.5)
Melting Point	430°F (221°C)
Product Status	Active
Shelf Life Start	-
Base Product Number	NC3SW
Storage/Refrigeration Temperature	-