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NC2SWLF.031 1LB

Chip Quik Inc.

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NC2SWLF.031 1LB

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Description:

LF SOLDER WIRE 99.3/0.7 TIN/COPP

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Mfr	Chip Quik Inc.
Form	Spool, 1 lb (454 g)
Type	Wire Solder
Series	-
Package	Bulk
Process	Lead Free
Diameter	0.031" (0.79mm)
Flux Type	No-Clean
Shelf Life	-
Wire Gauge	20 AWG, 21 SWG
Composition	Sn99.3Cu0.7 (99.3/0.7)
Melting Point	441°F (227°C)
Product Status	Active
Shelf Life Start	-
Base Product Number	NC2SW
Storage/Refrigeration Temperature	-