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LPC18S30FET100E

NXP USA Inc.

Product No:

LPC18S30FET100E

Manufacturer:

NXP USA Inc.

Package:

100-TFBGA (9x9)

Batch:

-

Datasheet:

-

Description:

IC MCU 32BIT ROMLESS 100TFBGA

Quantity:

Delivery:

Payment:

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LPC18S30FET100E - Product Information

Parameter Info

User Guide

Mfr NXP USA Inc.
Speed 180MHz
Series LPC18xx
Package Tray
RAM Size 200K x 8
Core Size 32-Bit Single-Core
EEPROM Size -
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Mounting Type Surface Mount
Number of I/O 49
Core Processor ARM® Cortex®-M3
Package / Case 100-TFBGA
Product Status Active
Data Converters A/D 4x10b; D/A 1x10b
Oscillator Type Internal
Base Product Number LPC18S30
Program Memory Size -
Program Memory Type ROMless
DigiKey Programmable Not Verified
Operating Temperature -40°C ~ 85°C (TA)
Supplier Device Package 100-TFBGA (9x9)
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V